The authors have demonstrated the local alignment of nematic liquid crystal with local micro-grating structure fabricated by the curing of an ultraviolet curable material via a three dimensional micro-fabrication technique known as two photon excitation direct laser writing [1]. The molecular alignment of the nematic liquid crystals on the fabricated micro-grating structures was firstly investigated by the observations of a local twisted nematic region in a liquid crystal cell made of a substrate with locally fabricated micro-grating structure and a counter substrate with rubbed polyimide. The optical polarizing microscope observation of the micro-grating structures indicated that liquid crystals molecules have aligned parallel to the grooves of the micro-grating structure and that local alignment was successfully achieved. The alignment characteristics of the liquid crystals on these micro-gratings was also investigated and discussed quantitatively in details through the measurement of anchoring energy by the conventional torque balance method and the Berreman method. The azimuthal anchoring energy for the micro-grating was found to be in the order of 10-6 J/m2 and inversely proportional to the grating period.

A 3.3-V 512-k 18-b 2-bank synchronous DRAM (SDRAM) has been developed using a novel 3-stage-pipelined architecture. The address-access path which is usually designed by analog means is digitized, separated into three stages by latch circuits at the column switch and data-out buffer. Since this architecture requires no additional read/write bus and data amp, it minimizes an increase in die size. Using the standardized GTL interface, a 250-Mbyte/s synchronous DRAM with die size of 113.7-mm2, which is the same die size as our conventional DRAM, has been achieved with 0.50-µm CMOS process technology.

A neural-signal sensing system with multi-input-channels was designed utilizing a new chopper amplifier with direct connected to a multiplexer. The proposed system consists of multiplexers, chopper amplifiers, a multi-mode analog-to-digital converter (ADC), and a wireless transmitter. It enables to measure 50-channel signals at the same time, which are selected out of 100 channels to detect useful information. The test chip including 10-channel-inputs chopper-amplifier and multi-mode ADC, that was designed and fabricated with a mixed signal 0.35-µm CMOS technology. Utilizing the proposed direct chopper input scheme and the shared chopper amplifier, the circuits was designed with a small area of 9.4 mm2. High accuracy channel selecting and multiplexing operations were confirmed, and an equivalent input noise of 10-nV/root-Hz was obtained with test chip measurements. Power dissipation of the chopper amplifier and the ADC were 6.0-mW and 2.5-mW at a 3-V supply voltage, respectively.

We propose a neural-sensing LSI with a bi-directional wireless interface, which is capable of detecting 5-channel neural signals in a living animal. The proposed sensing LSI consists of a multiplexer with 5-channels selectable from 10 channels, a chopper amplifier using a new direct-chopper-input scheme, a programmable multi-mode analog-to-digital converter (ADC), and a wireless-transmitter/receiver with BPSK modulation signals. The test-chip was implemented by mixed-signal 0.35-µm CMOS technology. We measured the test chip and confirmed basic operations of these blocks. The chopper-amplifier achieved 66-dB DC gain, bandwidth of 400 kHz, and 4-µV noise with power dissipation of 6-mW with a 3-V supply. We observed real nerve signals in a living cricket using the proposed chopper amplifier. ADC achieved 52-ksps operation with power dissipation of 0.43-mW at 3-V supply. The wireless transmitter achieved 1-Mbps data transmission at a distance of 1-m with 1.5-mW power dissipation at 3-V supply.

A new mm-wave IC, constructed by flip-chip bonded heterojunction transistors and microstrip lines formed on Si substrate, has been proposed and demonstrated by using MBB (micro bump boding) technology. Millimeter-wave characteristics of the MBB region has been estimated by electro-magnetic field analysis. Good agreements between calculated and measured characteristics of this new IC (named MFIC: millimeter-wave flip-chip IC) have been obtained up to 60 GHz band. Several MFIC amplifiers with their designed performances have been successfully fabricated.

Many of affine motion compensation techniques proposed thus far employ least-square-based techniques in estimating affine parameters, which requires a hardware structure different from conventional block-matching-based one. This paper proposes a new affine motion estimation/compensation framework friendly to block-matching-based parameter estimation, and applies it to an HEVC encoder to demonstrate its coding efficiency and computation cost. To avoid a nest of search loops, a new affine motion model is first introduced by decomposing the conventional 4-parameter affine model into two 3-parameter ones. Then, a block-matching-based fast parameter estimation technique is proposed for the models. The experimental results given in this paper show that our approach is advantageous over conventional techniques.

The authors have proposed a design method for two-dimensional (2-D) separable-denominator (SD) periodically time-variant digital filters (PTV DFs) and confirmed their superiority over 2-D time-invariant DFs. In that result, the periodicity matrix representing the periodicity of the varying filter coefficients is, however, restricted to two cases. This paper extends that idea so that the input-output relation of 2-D SD PTV DFs with an arbitrary periodicity matrix can be determined. This enables us to design wide range of 2-D PTV DFs.

A terahertz-wave communication system directly connected to an optical fiber network is promising for application to future mobile backhaul and fronthaul links. The possible broad bandwidth in the terahertz band is useful for high-speed signal transmission as well as radio-space encapsulation to the high-frequency carrier. In both cases, the low-latency feature becomes important to enhance the throughput in mobile communication and is realized by waveform transport technology without any digital-signal-processing-based media conversion. A highly precise optical frequency comb signal generated by optical modulation and the vector signal demodulation technology adopted from advanced optical fiber communication technologies help perform modulation and demodulation with impairment compensation at just the edges of the link. Terahertz wave, radio over fiber, waveform transport, coherent detection, multilevel modulation, radio on radio.

This paper proposes a bitstream scaling technique for MPEG video for the purpose of media synchronizations. The proposed scaling technique can reduce the frame rate as well as the bit rate of an MPEG data sequence to fit them to the values specified by a synchronization system. The advantage of the proposed technique over existing scaling methods is that it is considering not only the performance of synchronization but also the picture quality of the resulting sequences. To further improve the quality of sequences scaled by the proposed method, this paper also proposes an MPEG encoding technique which sets some of the parameters suitable for the scaling. An experiment using these techniques in an actual media synchronization system has illustrated the usefulness of the proposed approach.

This paper discusses a new design method for 2-D variable FIR digital filters, which is an extension of our previous work for 1-D case. The method uses a 3-D prototype FIR filter whose cross-sections correspond to the desired characteristics of 2-D variable FIR filters. A 2-D variable-angle FIR fan filter is given as a design example.

This paper describes new IC design concepts using flip-chip bonding technologies for microwave and millimeter-wave circuit integration. Two types of bonding technologies, stud bump bonding (SBB) and micro bump bonding (MBB) are introduced, and their applications to microwave and millimeter-wave ICs are presented. Receiver front-end hybrid IC (HIC) for cellular and PHS handsets using SBB and new millimeter-wave ICs on Si substrate called millimeter flip-chip IC (MFIC) using MBB have been designed and fabricated to prove their advantages. These flip-chip bonding technologies are experimentally proven to provide excellent solutions for high performance and compact-sized ICs with low-cost. The HIC concept is applicable consistently over a wide range of devices from RF/microwave to millimeter-wave region.

This paper describes new millimeter-wave ICs based on flip-chip bonding using micro bumps on a low cost silicon substrate, named millimeter-wave flip-chip ICs (MFICs). They have significant advantages such as good performance, low cost and excellent flexibility in the active device selection which makes them superior to conventional monolithic microwave integrated circuits (MMICs). In order to demonstrate these advantages, a K-band front-end block for a broadband wireless communication equipment was designed and fabricated. This front-end block consists of four MFIC chips: a low noise amplifier (LNA), a down converter and two medium power amplifiers. These chips are designed to satisfy stable operation conditions using a simplified model derived for micro bump bonding (MBB). In experimental measurements; the LNA using heterojunction field-effect transistors (HFETs) had an 18 dB gain, the down converter using an HFET had a 9. 5 dB conversion loss, and two power amplifiers using heterojunction bipolar transistors (HBTs) had saturated powers of 13. 0 dBm and 11. 7 dBm, respectively. The performance for each of the developed ICs agreed with the designed values, and satisfied circuit requirements. These results show that the MFIC technique is a potential technology for manufacturing multi-functional millimeter-wave ICs.

Highly miniaturization technology in front-end GaAs Hybrid IC for mobile communication equipment will be presented. A combination of MBB (micro bump bonding) technology and the new GaAs IC fabrication process using high dielectric constant (εr) thin film technology has achieved a super small HIC with low cost and low power consumption. The new HIC was constructed of only a ceramic substrate in which the spiral inductors were formed on it and the GaAs IC chip that was bonded by using MBB technology. The MBB technology lead the HIC to a lower temperature process without soldering, a smaller bump diameter, at shorter intervals and the lowest parasitic in the bump. The advantage of the small bonding pad of the IC contributes to miniaturize the IC chip and reduces the chip cost. The GaAs IC process technology using high-εr thin film achieves the integration of all capacitors in the IC without increasing the chip size. Furthermore, low power consumption was achieved by 0. 5-µm LDD BP-MESFET with a high k-value. Although capacitors were integrated on the IC, all of the inductors were formed on the top of the ceramic substrate using a thin film metal process. This was used due to its large occupation area when it was integrated on the IC, and produced a low Q-factor. As a results, the chip was minimized to a size of 0. 81. 0 mm2 and achieved a low-cost chip. Two types of HICs were fabricated for 880 MHz cellular band and 1. 9 GHz PHS (Personal Handy phone System) band. The HIC at 880 MHz measures only 5. 05. 01. 0 mm3, and offered a conversion gain of 25 dB, a noise figure of 4. 2 dB and an image rejection ratio of 12 dB at 2. 7 V and at a power supply of 3. 5 mA. The HIC for 1. 9 GHz measures only 3. 54. 01. 0 mm3, and showed a conversion gain of 16. 0 dB, a II P3 of -16. 0 dBm, and an image rejection ratio of over 20 dBc at 3. 0 V and at power supply of 4. 5 mA.

To detect neural spike signals, low-power neural signal recording frontend circuits must amplify neural signals with below 100 µV amplitude and a few hundred Hz frequency while suppressing a large DC offset voltage, 1/f noise of MOSFETs, and induced noise of AC power supply. To overcome the problem of unwanted noise at such a low signal level, a low-noise neural signal detection amplifier with low-frequency noise suppression scheme was developed utilizing a new autozeroing technique. A test chip was designed and fabricated with a mixed signal 0.18-µm CMOS technology. The voltage gain of 39 dB at the bandwidth of the neural signal and the gain reduction of 20 dB at AC supply noise of 60 Hz were obtained. The input equivalent noise and power dissipation were 90 nV/root-Hz and 90 µW at a supply voltage of 1.5 V, respectively.

In multidimensional signal sampling, the orthogonal sampling scheme is the simplest one and is employed in various applications, while a non-orthogonal sampling scheme is its alternative candidate. The latter sampling scheme is used mainly in application where the reduction of the sampling rate is important. In three-dimensional (3-D) signal processing, there are two typical sampling schemes which belong to the non-orthogonal samplings; one is face-centered cubic sampling (FCCS) and the other is body-centered cubic sampling (BCCS). This paper proposes a new design method for 3-D band-limiting FIR filters required for such non-orthogonal sampling schemes. The proposed method employs the McClellan transformation technique. Unlike the usual 3-D McClellan transformation, however, the proposed design method uses 2-D prototype filters and 2-D transformation filters to obtain 3-D FIR filters. First, 3-D general sampling theory is discussed and the two types of typical non-orthogonal sampling schemes, FCCS and BCCS, are explained. Then, the proposed design method of 3-D bandlimiting filters for these sampling schemes is explained and an effective implementation of the designed filters is discussed briefly. Finally, design examples are given and the proposed method is compared with other method to show the effectiveness of our methos.

This paper proposes a novel Depth From Defocus (DFD) technique based on the property that two images having different focus settings coincide if they are reblurred with the opposite focus setting, which is referred to as the “cross reblurring” property in this paper. Based on the property, the proposed technique estimates the block-wise depth profile for a target object by minimizing the mean squared error between the cross-reblurred images. Unlike existing DFD techniques, the proposed technique is free of lens parameters and independent of point spread function models. A compensation technique for a possible pixel disalignment between images is also proposed to improve the depth estimation accuracy. The experimental results and comparisons with the other DFD techniques show the advantages of our technique.

This paper proposes a design technique for 3-D non-separable QMF banks with Face-Centered Cubic Sampling (FCCS) and Body-Centered Cubic Sampling (BCCS). In the proposed technique, 2-D McClellan transformation is applied to a suitably designed 2-D prototype QMF to obtain 3-D QMFs. The design examples given in this paper demonstrate advantages of the proposed method.

In this paper, we propose an idea for intramedia synchronization control using a method of end-to-end delay monitoring to estimate future delay in delay compensation protocol. The estimated value by Kalman filtering at the presentation site is used for feedback control to adjust the retrieval schedule at the source according to the network conditions. The proposed approach is applicable for the real time retrieving application where `tightness' of temporal synchronization is required. The retrieval schedule adjustment is achieved by two resynchronization mechanisms-retrieval offset adjustment and data unit skipping. The retrieval offset adjustment is performed along with a buffer level check in order to compensate for the change in delay jitter, while the data unit skipping control is performed to accelerate the recovery of unsynchronization period under severe conditions. Simulations are performed to verify the effectiveness of the proposed scheme. It is found that with a limited buffer size and tolerable latency in initial presentation, using a higher efficient delay estimator in our proposed resynchronization scheme, the synchronization performance can be improved particularly in the critically congested network condition. In the study, Kalman filtering is shown to perform better than the existing estimation methods using the previous measured jitter or the average value as an estimate.

This paper proposes low-complexity pre- and post-frequency domain equalization and frequency diversity combining methods for block transmission schemes with cyclic prefix. In the proposed methods, the equalization and diversity combining are performed simultaneously in discrete frequency domain. The weights for the proposed equalizer and combiner are derived based on zero-forcing and minimum-mean-square error criteria. We demonstrate the performance of the proposed methods, including bit-error rate performance and peak-to-average power ratios of the transmitted signal, via computer simulations.

This paper discusses a new simultaneous design method of both magnitude and phase of IIR digital filters. It is inherently a nonlinear problem to approximate the magnitude and phase of an IIR digital filter simultaneously. In this paper, however, such a nonlinear problem is converted into a linear one by vector rotation method and solved by the linear programming (LP) technique. As a result our method requires no initial guesses for any type of filter specifications. A stable digital filter is designed which approximately satisfies the linearity of the phase in the pass band and the given attenuation in the stop band. The design examples given in this paper shows the usefulness of the proposing method.